Manufacturing & Assembly

Manufacturing Services and Technology
Plexus provides integrated turnkey solutions, utilizing leading-edge manufacturing technologies to support customer time to market requirements. Plexus focuses on quality, service, and flexibility serving the Wireless Infrastructure, Wireline/Networking, Medical, Industrial/Commercial, Defense/Security/Aerospace market sectors. Customers can engage in this process at any point. Plexus redefines the standard for responding to the customer's business requirements with its ability to optimize the supply chain design for each customer's needs. Plexus commits to offering global manufacturing solutions in North America, Europe, and Asia. From distribution to warranty repair and service, and end-of-life management, Plexus continues its role as a full service partner after a product is manufactured.

Customer Teams and the Focused Factory Concept
The Focused Factory concept enhances the basic cellular principal by providing flexibility to uniquely configure, staff and equip each Focused Factory to meet specific needs of the customer. Focused Factories may support various levels of assembly, technology, volume, mix, material strategy, and agency requirements. Dedicated customer teams support the growing needs of customers. These teams are composed of program management, documentation, materials, quality, finance, and Focused Factory personnel.

Manufacturing Transition
Plexus processes provide a seamless transition of products into manufacturing. The Manufacturing Transition Team, led by a dedicated and experienced manager, has a wide array of expertise. This team utilizes several transition tools to develop a comprehensive plan focused on timelines, tracking issues, and metrics.

Assembly Capabilities Printed Circuit Board Assembly (PCBA)
  • Printed Circuit Board Assembly (PCBA)
    • Through Hole
    • Surface Mount (SMT)
    • Flip Chip
    • BGA
    • Chip Scale Package (CSP)
  • HLA/Box Build/System
    • Configure-to-Order (CTO)
    • Build-to-Order (BTO)
    • Direct Order Fulfillment (DOF)
  • Focused Factory Environment
  • Single Board Process Flow and Strategic KANBANS
  • Optics
    • Component Integration
    • Fiber Management
    • Fusion Splicing
  • Medical Class I, II & III
  • ITAR Compliant
  • RoHS Compliance
  • Laminates - Rigid, PCMCIA Rigid Flex, Flex, >.250" Thickness, Low Dk

Passive Discrete 0101 Component Technology
  • 0.4mm Pitch QFP
  • Flip Chip - Up to 18mm x 35mm x 0.1 mm die
  • BGA - > 1500 I/O
  • CBGA - > 800 I/O
  • CCGA - > 1500 I/O
  • PGA - > 591 I/O
  • Chip Scale Package (CSP), to 0.4mm Pitch
  • Passive Discrete - 0101
  • Optical Actives and Passives



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