Plexus is a proven leader in advanced semiconductor packaging solutions and is uniquely positioned to design, qualify and manufacture multi die microelectronic solutions from micro-implantable medical devices and portable RF instruments to high-end infrastructure systems. Early engagement of Plexus' engineering team will allow leverage of enabling Intellectual Property from key technology partners and allow Plexus' 400 plus design team to remove technology barriers that prevent products from getting to the market. The full suite of design capabilities that we offer can then be wrapped around the engineering team to create a design that realizes the product in a fast, efficient manner and results in a high reliability product that is manufacturable and testable. The cross functional engineering team assigned to your concept will drive aggressively to achieve your time to market goals while ensuring a reliable and high performance package design. Building on the design services, Plexus will wrap a suite of services around unique package qualification and test requirements. Through a phase gate process, Plexus will fully characterize assembly materials and package designs to support industry and regulatory qualification requirements with objective evidence. As a product moves into sustainable manufacturing either on or off shore, Plexus' manufacturing excellence and customer team methodologies will be deployed to continuously drive yield improvement. Plexus will also leverage the supply chain and lean manufacturing practices to proactively drive cost down activities. Plexus can merge our standard board and box build expertise to deliver a finished product to the end customers in a Configure-to-Order (CTO), Build-to-Order (BTO) or Direct Order Fulfillment (DOF). 
Key Market Sectors for Microelectronic Services
Packaging Technologies
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